Organic electroluminescence device and method for manufacturing same

ABSTRACT

An organic electroluminescence device includes a substrate; first electrodes arranged on the luminous portion of the substrate in a single direction; an insulating layer pattern formed on the first electrodes and the substrate in a lattice shape to define plural pixel openings on the first electrodes; partition layers formed on the insulating layer pattern, the partition layers intersecting the first electrodes perpendicularly; organic thin film layer formed on the pixel openings; second electrodes formed on the organic thin film layer to be perpendicular to the first electrodes; first bus electrode patterns formed on the pad portion of the substrate to be connected with the first electrodes; second bus electrode patterns formed on the pad portion of the substrate to be connected with the second electrodes and including a material for forming the second electrodes; and barrier films formed between the second bus electrode patterns.

FIELD OF THE INVENTION

The present invention relates to an organic electroluminescence device;and, more particularly, to an organic electroluminescence device capableof reducing a resistance of a bus electrode pattern, and a method formanufacturing same.

BACKGROUND OF THE INVENTION

In general, an organic electroluminescence device (OLED) is one of flatplate display devices, and it is formed by interposing an organic thinfilm between an anode layer and a cathode layer on a wafer. The OLED isof a very thin matrix shape.

The OLED has many advantages in that it can be operated at a very lowvoltage and it is very thin. Thus, the OLED can solve the drawbacks of aconventional LCD including a narrow optical viewing angle, a lowresponse speed, etc. In comparison with other types of displays, inparticular, those of middles sizes, the OLED can provide the same imagequality as that of, for example, a ‘TFT LCD’ or even higher ones thanthat. Furthermore, since the manufacturing process for the OLED issimple, the OLED has been attracting attention as the next-generationflat plate display device.

Referring to FIG. 1, there is illustrated a partial view of aconventional OLED.

As shown in the figure, the conventional OLED has a plurality of firstelectrodes 110 arranged in a parallel stripe pattern on a substrate 100divided into a luminous portion A and a pad portion B. A multiplicity ofsecond electrodes 120 is installed on the first electrodes 110 to beperpendicular thereto. Pixels 130 of the organic electroluminescencedevice are defined at intersecting areas of the first and the secondelectrodes 110 and 120, respectively, that are arranged orthogonally.Also, on every pixel 130, an organic thin film layer 140 including anorganic emission layer is formed between the first electrodes 110 andthe second electrodes 120.

Formed on the pad portion B of the substrate 100 are plural buselectrode patterns 150 and 160 connected to the second and the firstelectrodes 120 and 110, respectively. The bus electrode patterns 150 and160 are typically formed together with the first electrodes 110, andthey may be made of a transparent conductive material such as indium tinoxide (ITO), like the first electrodes 110. Further, auxiliaryelectrodes (not shown) made of chrome (Cr) or the like may be formed ona predetermined area of the first electrodes 110 to reduce theresistance thereof. In such a case, the bus electrode patterns 150 and160 are formed together with the first electrodes 110 and the auxiliaryelectrodes, and thus ITO and Chrome (Cr) may be laminated in sequence.Further, though not shown in the drawing, a tape carrier package (TCP)is installed on the pad portion B such that it is electrically connectedwith the first electrodes 110, the second electrodes 120 and the buselectrode patterns 150 and 160. The TCP operates to apply electricsignals to the pad portion B, thus driving the OLED.

It is well known in the art that, as the resistance of the bus electrodepatterns 150 and 160 of the pad portion B decreases, a voltage drop dueto the bus electrodes can be reduced when driving the OLED, which inturn allows a manufacture of a device featuring a low driving voltageand a low power consumption. For the reason, the resistance of the buselectrode patterns 150 and 160 needs to be reduced.

SUMMARY OF THE INVENTION

It is, therefore, an object of the present invention to provide anorganic electroluminescence device (OLED) having a bus electrode patternof a low resistance, thus reducing a power consumption and a drivingvoltage, thereby resulting in improvement of electrical characteristicsof the device. In accordance with a first aspect of the presentinvention, there is provided an organic electroluminescence deviceincluding:

a substrate having a luminous portion and a pad portion;

first electrodes arranged on the luminous portion of the substrate in asingle direction;

an insulating layer pattern formed on the first electrodes and thesubstrate in a lattice shape to define plural pixel openings on thefirst electrodes;

partition layers formed on the insulating layer pattern, the partitionlayers intersecting the first electrodes perpendicularly;

organic thin film formed on the pixel openings;

second electrodes formed on the organic thin film layer to beperpendicular to the first electrodes;

first bus electrode patterns formed on the pad portion of the substrateto be connected with the first electrodes;

second bus electrode patterns formed on the pad portion of the substrateto be connected with the second electrodes and containing a material forforming the second electrodes; and

barrier films formed between the second bus electrode patterns.

In accordance with a second aspect of the present invention, there isprovided a method for forming an organic electroluminescence deviceincluding the steps of:

forming first electrodes on a substrate in a single direction, thesubstrate having a luminous portion on which the first electrodes areformed and a pad portion;

forming first bus electrode patterns on the pad portion of the substratesuch that the first bus electrode patterns are connected with the firstelectrodes while forming the first electrodes, the first bus electrodepatterns including a material for forming the first electrodes;

forming second bus electrode patterns on the pad portion of thesubstrate while forming the first electrodes, the second bus electrodepatterns including the first electrode forming material;

forming an insulating layer pattern on the first electrodes and thesubstrate in a lattice shape to define plural pixel openings on thefirst electrodes;

forming partition layers on the insulating layer pattern, the partitionlayers intersecting the first electrodes perpendicularly;

forming barrier films between the second bus electrode patterns whileforming the partition layers;

forming an organic thin film layer on the pixel openings;

forming second electrodes on the organic thin film layer to beperpendicular to the first electrodes; and

depositing a second electrode forming material on the second buselectrode patterns while forming second electrodes.

In accordance with a third aspect of the present invention, there isprovided a method for forming an organic electroluminescence deviceincluding the steps of:

forming first electrodes on a substrate in a single direction, thesubstrate having a luminous portion on which the first electrodes areformed and a pad portion;

forming first bus electrode patterns on the pad portion of the substratesuch that the first bus electrode patterns are connected with the firstelectrodes while forming the first electrodes, the first bus electrodepatterns including a material for forming the first electrodes;

forming second bus electrode patterns on the pad portion of thesubstrate while forming the first electrodes, the second bus electrodepatterns including the first electrode forming material;

forming an insulating layer pattern on the first electrodes and thesubstrate in a lattice shape to define plural pixel openings on thefirst electrodes;

forming partition layers on the insulating layer pattern, the partitionlayers intersecting the first electrodes perpendicularly;

forming barrier films between the first bus electrode patterns and thesecond bus electrode patterns while forming the partition layers;

forming an organic thin film layer on the pixel openings;

forming second electrodes on the organic thin film layer to beperpendicular to the first electrodes; and

depositing a second electrode forming material on the first and thesecond bus electrode patterns while forming the second electrodes.

In accordance with a fourth aspect of the present invention, there isprovided a method for forming an organic electroluminescence deviceincluding the steps of:

forming first electrodes on a substrate in a single direction, thesubstrate having a luminous portion on which the first electrodes areformed and a pad portion;

forming first bus electrode patterns on the pad portion of the substratesuch that the first bus electrode patterns are connected with the firstelectrodes while forming the first electrodes, the first bus electrodepatterns including a material for forming the first electrodes;

forming an insulating layer pattern on the first electrodes and thesubstrate in a lattice shape to define plural pixel openings on thefirst electrodes;

forming partition layers on the insulating layer pattern, the partitionlayers intersecting the first electrodes perpendicularly;

forming barrier films on the pad portion of the substrate while formingthe partition layers;

forming an organic thin film layer on the pixel openings;

forming a mask film pattern for blocking the first bus electrodepatterns;

forming second electrodes on the organic thin film layer to beperpendicular to the first electrodes by using the mask film pattern;and

depositing a second electrode forming material between the barrier filmsto thereby form second bus electrode patterns while forming the secondelectrodes.

In accordance with a fifth aspect of the present invention, there isprovided a method for forming an organic electroluminescence deviceincluding the steps of:

forming first electrodes on a substrate in a single direction, thesubstrate having a luminous portion on which the first electrodes areformed and a pad portion;

forming an insulating layer pattern on the first electrodes and thesubstrate in a lattice shape to define plural pixel openings on thefirst electrodes;

forming partition layers on the insulating layer pattern, the partitionlayers intersecting the first electrodes perpendicularly;

forming barrier films on the pad portion of the substrate while formingthe partition layers;

forming an organic thin film layer on the pixel openings;

forming second electrodes on the organic thin film layer to beperpendicular to the first electrodes; and

depositing a second electrode forming material between the barrier filmsto thereby form first and second bus electrode patterns while formingthe second electrodes.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and features of the present invention willbecome apparent from the following description of preferred embodimentsgiven in conjunction with the accompanying drawings, in which:

FIG. 1 presents a partial view of a conventional organicelectroluminescence device;

FIG. 2 sets forth a partial view of an organic electroluminescencedevice in accordance with the present invention;

FIGS. 3 to 9 provide drawings for describing a manufacturing process foran organic electroluminescence device in accordance with a firstpreferred embodiment of the present invention;

FIGS. 10 to 13 depict drawings for describing a manufacturing processfor an organic electroluminescence device in accordance with a secondpreferred embodiment of the present invention;

FIGS. 14 to 20 offer drawings for describing a manufacturing process foran organic electroluminescence device in accordance with a thirdpreferred embodiment of the present invention; and

FIGS. 21 to 26 show drawings for describing a manufacturing process foran organic electroluminescence device in accordance with a fourthpreferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, preferred embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings. Here,it is to be noted that the present invention is not limited to thepreferred embodiments disclosed herein but can be modified in variousways. In the drawings, the thicknesses of elements are enlarged to showvarious layers and regions clearly. Further, in the followingdescription, like reference numerals represents like components.

FIG. 2 sets forth a partial view of an organic electroluminescencedevice in accordance with the present invention; and FIGS. 3 to 9illustrate a method for manufacturing the organic electroluminescencedevice in accordance with a first preferred embodiment of the presentinvention. In particular, FIG. 9 is a partial cross sectional view takenalong a line I-I′ of FIG. 8.

As shown in FIG. 2, the organic electroluminescence device of thepresent invention includes: a substrate 300 divided into a luminousportion A and a pad portion B; first electrodes 310 arranged on theluminous portion A of the substrate 300 in a single direction; aninsulating layer pattern 340 formed on the first electrodes 310 and thesubstrate in a lattice shape to define plural pixel openings for pixelson the first electrodes 310; partition layers 360 formed on the area ofthe insulating layer pattern 340 intersecting the first electrodesperpendicularly; an organic thin film layer (not shown) deposited on thepixel openings; second electrodes 380 arranged on the pad portion B ofthe substrate 300 to be perpendicular to the first electrodes 310; firstbus electrode patterns 320 formed on the pad portion B of the substrateB to be electrically connected with the first electrodes 310; second buselectrode patterns 390 formed on the pad portion B of the substrate 300,the second bus electrode patterns being formed together with the secondelectrodes 380 with the same material as that forming the secondelectrodes 380, to be electrically connected therewith; and barrierfilms 365 formed between the second bus electrode patterns 390. Thebarrier films 365 are connected with the partition layers 360 formed onthe luminous portion A of the substrate 300.

Though not shown in the figure, the barrier films 365 can also be formedbetween the first bus electrode patterns 320 and/or between the secondbus electrode patterns 330.

A method for manufacturing an organic electroluminescence device inaccordance with a first preferred embodiment of the present inventionwill be described with reference to FIGS. 3 to 9.

Referring to FIG. 3, first electrodes 310 are formed on a substrate 300including a luminous portion A and a pad portion B such that they arearranged in a single direction in parallel to each other. While formingthe first electrodes 310, bus electrode patterns, e.g., first and secondbus electrode patterns 320 and 330, respectively, to be connected withan external driving circuit later are also formed on the pad portion Bof the substrate 200. The first bus electrode patterns 320 are connectedwith the first electrodes 310, whereas the second bus electrode patterns330 are connected with second electrodes to be formed later.

In general, the substrate 300 is made of glass, and the first electrodes310 are made of a transparent conductive material such as indium tinoxide (ITO) or indium zinc oxide (IZO). Further, the first and thesecond bus electrode patterns 320 and 330, respectively, are formedtogether with the first electrodes 310, and are also made of the sametransparent conductive material as that forming the first electrodes310, e.g., ITO or IZO. Also, if auxiliary electrodes (not shown) areselectively formed on predetermined areas of the first electrodes 310with a material having a small resistance and a small resistivity suchas chrome (Cr) or molybdenum (Mo) in order to obtain the purpose ofreducing the resistance of the first electrodes 310, the first and thesecond bus electrode patterns 320 and 330 are, respectively, formedtogether with the first electrodes 310 and the auxiliary electrode. As asequence, each of them is configured to have a laminated structure ofITO and Cr or IZO and Cr deposited in sequence.

Referring to FIG. 4, an insulating layer pattern 340 is formed on thefirst electrodes 310 to have a lattice shape when viewed from a planview, to thereby define pixel openings 350. The pixel openings 350formed by the insulating layer pattern 340 define pixel formation areason which pixels are to be formed.

Then, referring to FIG. 5, after depositing a negative type photo-resistfilm on the entire surface of the substrate 300 including the insulatinglayer pattern 340, an exposure and a development process are performedto form partition layers 360, each having an adverse slope. Thepartition layers 360 are arranged at a preset interval such that theyare parallel to each other and are perpendicular to the first electrodes310. Further, the partition layers 360 have an overhang structure toprevent the second electrodes to be formed later from beingshort-circuited from neighboring elements.

While forming the partition layers 360 on the entire surface of thesubstrate 300, barrier films 365 are formed between the second buselectrode patterns 330. Preferably, the barrier films 360 are connectedwith the partition layers 360. The barrier films 365 are located betweenthe second bus electrode patterns 330 on the pad portion B, and theyserve to separate the second bus electrode patterns 330 from each other.The barrier films 365 may be formed of the same material as that formingthe partition layers 360, for example, a negative-type photo-resistfilm.

Subsequently, as shown in FIG. 6, an organic thin film layer 370including an organic emission layer and the like is deposited on thepixel openings on which pixels are to be formed. Though not shown in thedrawing, the organic thin film layer 370 is configured to have alaminated structure including a hole injecting layer, a holetransporting layer, a light-emitting layer and an electron transportinglayer.

Thereafter, as shown in FIG. 7, a mask film pattern 375 is formed tocover the areas of the pad portion B on which the first bus electrodepatterns 320 are located. The mask film pattern 375 serves to prevent adeposition of first bus electrode patterns (not shown) when depositingthe second electrodes during a subsequent process.

Next, as shown in FIGS. 8 and 9, second electrodes 380 are formed on theorganic thin film layer 370 in a manner that they are perpendicular tothe first electrodes 310. The second electrodes 380 may be formed of ametallic material used for forming electrode, such as aluminum (Al),copper (Cu) or silver (Ag) or an alloy thereof.

At this time, while forming the second electrodes 380 on the organicthin film layer 370, the material for forming the second electrodes 380is extended to and deposited on the pad portion B of the substrate 300.The material for forming the second electrodes 380 is anelectrode-forming metallic material containing Al, Cu or Ag or an alloythereof.

Accordingly, the second bus electrode patterns 390 are configured tohave a laminated structure including the layer of the second electrodeforming material deposited on ITO or IZO or a laminated structureincluding the layer of the second electrode forming material depositedon ITO and Cr or IZO and Cr layers laminated in sequence.

If the second electrode forming material, e.g., Al is deposited on thesecond bus electrode patterns 330 formed of two layers 330 a and 330 bof ITO and Cr or IZO and Cr laminated in sequence, the resistance of thearea having the second electrode forming material deposited thereon isreduced 1/10 to a ⅛ of the conventional resistance. Thus, when drivingthe organic electroluminescence device by connecting it to an externaldriving circuit later, a power consumption and a driving voltage arereduced, resulting in improvement of the electrical characteristics ofthe device.

FIGS. 10 to 13 describe a method for manufacturing an organicelectroluminescence device in accordance with a second preferredembodiment of the present invention. In particular, FIG. 13 shows across sectional view taken along a line V-V′ of FIG. 12.

First, as set forth above with reference to FIGS. 3 and 4, firstelectrodes 310, first bus electrode patterns 320 and second buselectrode patterns 330 are formed on a substrate 300 including aluminous portion A and a pad portion B. Then, a lattice-shape insulatinglayer pattern 340 is formed on the first electrodes 310 to define pixelopenings 350.

Thereafter, as shown in FIG. 10, a photo-resist film is deposited on theentire surface of the substrate 300, after which an exposure and adevelopment process are conducted to obtain partition layers 360 with anadverse slope. The partition layers 360 are arranged in parallel to eachother and perpendicular to the first electrodes 310. Also, the partitionlayers 360 have an overhang structure.

While forming the partition layers 360, barrier films 365 areconcurrently formed between the first and the second bus electrodepatterns 320 and 330. The barrier films 365 serve to prevent the firstand the second bus electrode patterns 320 and 330 from beingshort-circuited when depositing a material for forming second electrodeslater. The barrier films 365 between the second bus electrode patterns330 are preferably connected to the partition layers 360. Further, thebarrier films 365 between the first bus electrode patterns 320 may alsobe connected to the partition layers 360.

Subsequently, as shown in FIG. 11, an organic thin film layer 370including an organic emission layer and the like is deposited on thepixel openings 350.

Then, as shown in FIGS. 12 and 13, second electrodes 380 are formed onthe organic thin film layer 370 such that they are perpendicular to thefirst electrodes 310. While forming the second electrodes 380 on theorganic thin film layer 370, the material for forming the secondelectrodes is extended to and deposited on the pad portion B of thesubstrate 300, thus obtaining first bus electrode patterns 395 andsecond bus electrode patterns 390 having the second electrode formingmaterial deposited thereon. The first bus electrode patterns 395 mayinclude laminated multi-layer structures 320 a and 320 b formed of ITOand Cr or IZO and Cr layers deposited in sequence. The material forforming the second electrodes includes Al, Cu or Ag. Further, since theareas on which the first bus electrode patterns 395 and the second buselectrode patterns 390 are to be formed are already separated due to thepresence of the barrier films 365 which have been formed in advance, thedeposition of the second electrode forming material can be conductedwithout having to use a mask.

As described, with the structure including the layer of the secondelectrode forming material deposited on bus electrode patterns formed ofITO and Cr or IZO and Cr laminated in sequence, the first and the secondbus electrode patterns 395 and 390, respectively, are allowed to have afurther reduced resistance. As a consequence, when driving the organicelectroluminescence device by connecting it to an external drivingcircuit later, a power consumption and a driving voltage can be reduced,resulting in improvement of the electrical characteristics of thedevice.

FIGS. 14 to 20 describe a method for manufacturing an organicelectroluminescence device in accordance with a third preferredembodiment of the present invention. In particular, FIG. 20 is a partialcross sectional view taken along a line X-X′ of FIG. 19.

Referring to FIG. 14, first electrodes 410 are formed on a substrate 400including a luminous portion A and a pad portion B such that they arearranged in a single direction in parallel to each other. While formingthe first electrodes 410, bus electrode patterns to be connected to anexternal driving circuit later, e.g., first bus electrode patterns 420are also formed on the pad portion B of the substrate 400. The first buselectrode patterns 420 are connected with the first electrodes 410.

The first electrodes 410 are made of a transparent conductive materialsuch as ITO or IZO. Further, the first bus electrode patterns 420 formedtogether with the first electrodes 410 are also made of the sameconductive material as that for forming the first electrodes 410, e.g.,ITO or IZO. Also, auxiliary electrodes (not shown) may be selectivelyformed on predetermined areas of the first electrodes 410 with amaterial having a small resistance and a small resistivity, e.g., Cr orMo, for the purpose of reducing the resistance of the first electrodes410. In such a case, the first bus electrode patterns 420 can be formedtogether with the first electrodes 410 and the auxiliary electrodes, andthus the first bus electrode patterns 420 can be configured to have alaminated multi-layer structure of ITO and Cr or IZO and Cr deposited insequence.

Meanwhile, the rest area of the pad portion B except for where the firstbus electrode patterns 420 are formed, e.g., the area on which secondbus electrode patterns connected with second electrodes are to beformed, can be formed at a time of depositing an electrode material forforming the second electrodes. Description thereof will be providedlater.

Referring to FIG. 15, an insulating layer pattern 440 is formed on thefirst electrodes 410 disposed on the luminous portion A of the substrate400 such that it has a lattice shape when viewed from a plan view, tothereby define pixel openings 450 on the first electrodes 410. The pixelopenings 450 formed by the insulating layer pattern 440 define pixelformation areas on which pixels are to be formed.

Then, referring to FIG. 16, after depositing a photo-resist film on theentire surface of the substrate 400 including the insulating layerpattern 440, an exposure and a development process is performed, so thatpartition layers 460 each having an adverse slope are obtained. Thepartition layers 460 are arranged at a preset interval such that theyare parallel to each other and are perpendicular to the first electrodes410. Further, the partition layers 460 have an overhang structure toprevent the second electrodes to be formed later from beingshort-circuited from neighboring elements.

While forming the partition layers 460, barrier films 465 are extendedto and formed on the pad portion B. Preferably, the barrier films 465are connected with the partition layers 460. The barrier films 465 arelocated between the second bus electrode patterns to be formed later,and they serve to separate the second bus electrode patterns from eachother. The barrier films 465 may be formed of the same material as thatof forming the partition layers 460, for example, a negative-typephoto-resist film.

Subsequently, referring to FIG. 17, an organic thin film layer 470including an organic emission layer and the like is formed on the pixelopenings 450. Though not shown in the drawing, the organic thin filmlayer 470 is configured to have a laminated structure including a holeinjecting layer, a hole transporting layer, an organicelectroluminescent layer and an electron transporting layer, all ofwhich are laminated on the pixel openings formed by the insulating layerpattern 440.

Thereafter, referring to FIG. 18, a mask film pattern 480 is formed tocover the areas of the pad portion B on which the first bus electrodepatterns 420 are located. The mask film pattern 480 serves to block thefirst bus electrode patterns 420 when depositing a second electrodeforming material during a subsequence process.

Next, as shown in FIGS. 19 and 20, second electrodes 490 are formed onthe organic thin film layer 470 in a manner such that they areperpendicular to the first electrodes 410. Each second electrode 480 maybe configured as a single layer or multi layers having two or morelayers formed of a metallic material containing Al, Cu or Ag.

While forming the second electrodes 490 on the organic thin film layer470, the material for forming the second electrodes 490 is also extendedto and deposited on the pad portion B of the substrate 400 to therebyform second bus electrode patterns 500 on the pad portion B. The secondelectrode forming material is a metallic material such as Al, Cu or Ag.At this time, the second bus electrode patterns 500 are separated by thebarrier films 465 which have been formed in advance.

As described, if the second bus electrode patterns 500 is formed by thedeposition of the second electrode forming material, e.g., Al, theresistance of the second bus electrode patterns 500 can be furtherreduced in comparison with the case of forming the second bus electrodepatterns as a laminated multi-layer structure of ITO and Cr or IZO andCr deposited in sequence.

Thus, when driving the organic electroluminescence device by connectingit to an external driving circuit later, a power consumption and adriving voltage are reduced, resulting in improvement of the electricalcharacteristics of the device. Furthermore, by forming the second buselectrode patterns as a single layer containing the second electrodeforming material, a defect generation can be reduced in comparison withthe case of forming the second bus electrode patterns as a laminatedmulti-layer structure of ITO and Cr or IZO and CR. As a consequence, thereliability of the device can be improved.

FIGS. 21 to 26 describe a method for manufacturing an organicelectroluminescence device in accordance with a fourth preferredembodiment of the present invention. In particular, FIG. 26 is a partialcross sectional view taken along a line Y-Y′ of FIG. 25.

Referring to FIG. 21, first electrodes 410 are formed on a substrate 400including a luminous portion A and a pad portion B such that they arearranged in a single direction in parallel to each other. The firstelectrodes 410 are formed of a transparent conductive material such asITO or IZO.

Meanwhile, bus electrode patterns on the pad portion B, e.g., first buselectrode patterns to be connected with the first electrodes and secondbus electrode patterns to be connected with second electrodes, can beformed at a time of depositing an electrode material for forming thesecond electrodes. Description thereof will be provided later.

Referring to FIG. 22, an insulating layer pattern 440 of a lattice shapeis formed on the first electrodes 410 disposed on the luminous portion Aof the substrate 400, to thereby define pixel openings 450 on the firstelectrodes 410.

Then, referring to FIG. 23, after depositing a photo-resist film on theentire surface of the substrate 400 including the insulating layerpattern 440, an exposure and a development process are performed, sothat partition layers 460 each having an adverse slope are obtained. Thepartition layers 460 are arranged at a preset interval such that theyare parallel to each other and are perpendicular to the first electrodes410. Further, the partition layers 460 have an overhang structure toprevent the second electrodes to be formed later from beingshort-circuited from neighboring elements.

While forming the partition layers 460, barrier films 465 are extendedto and formed on the pad portion B, wherein the barrier films 465 serveto prevent a generation of a short-circuit between bus electrodepatterns when depositing the second electrode forming material later.

Subsequently, referring to FIG. 24, an organic thin film layer 470including an organic emission layer and the like is formed on the pixelopenings. Though not shown in the drawing, the organic thin film layer470 may be configured to have a laminated structure including a holeinjecting layer, a hole transporting layer, an organicelectroluminescent layer and an electron transporting layer, all ofwhich are laminated on the pixel openings formed by the insulating layerpattern 440.

Next, as shown in FIGS. 25 and 26, the second electrodes 490 are formedon the organic thin film layer 470 in a manner such that they areperpendicular to the first electrodes 410. Each second electrode 490 maybe configured as a single layer or multi layers having two or morelayers formed of a metallic material including Al, Cu or Ag.

While forming the second electrodes 490 on the organic thin film layer470, the material for forming the second electrodes 490 is alsodeposited on the pad portion B of the substrate 400 to thereby form thefirst and the second bus electrode patterns 510 and 500, respectively,on the pad portion B. The second electrode forming material is ametallic material including Al, Cu or Ag. At this time, since the areason which the first and the second bus electrode patterns 510 and 500,respectively, are to be formed are already separated by the barrierfilms 465 which have been formed in advance, the deposition of thesecond electrode forming material can be carried out without having touse a mask.

As described, if the first and the second bus electrode patterns 510 and500, respectively, are formed by the deposition of the second electrodeforming material, e.g., Al, the resistance of the first and the secondbus electrode patterns 510 and 500, respectively, can be further reducedin comparison with the case of forming them to have a laminatedmulti-layer structure of ITO and Cr or IZO and Cr deposited in sequence.

Thus, when driving the organic electroluminescence device by connectingit to an external driving circuit later, a power consumption and adriving voltage are reduced, resulting in improvement of the electricalcharacteristics of the device. Furthermore, by forming each of the firstand the second bus electrode patterns as a single layer containing thesecond electrode forming material, a defect generation can be reduced incomparison with the case of forming the second bus electrode patterns asa laminated multi-layer structure of ITO and Cr or IZO and Cr insequence. As a consequence, the reliability of the device can beimproved.

While the invention has been shown and described with respect to thepreferred embodiments, it will be understood by those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the invention as defined in the followingclaims.

1. An organic electroluminescence device comprising: a substrate havinga luminous portion and a pad portion; first electrodes arranged on theluminous portion of the substrate in a single direction; an insulatinglayer pattern formed on the first electrodes and the substrate in alattice shape to define plural pixel openings on the first electrodes;partition layers formed on the insulating layer pattern, the partitionlayers intersecting the first electrodes perpendicularly; organic thinfilm layer formed on the pixel openings; second electrodes formed on theorganic thin film layer to be perpendicular to the first electrodes;first bus electrode patterns formed on the pad portion of the substrateto be connected with the first electrodes; second bus electrode patternsformed on the pad portion of the substrate to be connected with thesecond electrodes and containing a material for forming the secondelectrodes; and barrier films formed between the second bus electrodepatterns.
 2. The device of claim 1, further including barrier filmsformed between the first bus electrode patterns.
 3. The device of claim2, wherein the barrier films formed between the second bus electrodepatterns are connected with the partition layers.
 4. The device of claim1, wherein each of the first bus electrode patterns has a single layerstructure formed of indium tin oxide (ITO) or indium zinc oxide (IZO);or a laminated multi-layer structure formed of ITO and chrome (Cr), orIZO and Cr.
 5. The device of claim 1, wherein the second electrodeforming material is a metallic material including aluminum (Al), copper(Cu) or silver (Ag) or an alloy thereof.
 6. The device of claim 5,wherein each of the second bus electrode patterns has a laminatedmulti-layer structure formed of ITO and the second electrode formingmaterial; or IZO and the second electrode forming material.
 7. Thedevice of claim 5, wherein each of the second bus electrode patterns hasa laminated multi-layer structure formed of ITO, Cr and the secondelectrode forming material; or IZO, Cr and the second electrode formingmaterial.
 8. The device of claim 5, wherein each of the second buselectrode patterns has a single layer structure formed of the secondelectrode forming material.
 9. A method for forming an organicelectroluminescence device comprising the steps of: forming firstelectrodes on a substrate in a single direction, the substrate having aluminous portion on which the first electrodes are formed and a padportion; forming first bus electrode patterns on the pad portion of thesubstrate such that the first bus electrode patterns are connected withthe first electrodes while forming the first electrodes, the first buselectrode patterns including a material for forming the firstelectrodes; forming second bus electrode patterns on the pad portion ofthe substrate while forming the first electrodes, the second buselectrode patterns including the first electrode forming material;forming an insulating layer pattern on the first electrodes and thesubstrate in a lattice shape to define plural pixel openings on thefirst electrodes; forming partition layers on the insulating layerpattern, the partition layers intersecting the first electrodesperpendicularly; forming barrier films between the second bus electrodepatterns while forming the partition layers; forming an organic thinfilm layer on the pixel openings; forming second electrodes on theorganic thin film layer to be perpendicular to the first electrodes; anddepositing a second electrode forming material on the second buselectrode patterns while forming the second electrodes.
 10. The methodof claim 9, wherein the barrier films formed between the second buselectrode patterns are connected with the partition layers.
 11. Themethod of claim 9, wherein each of the first bus electrode patterns hasa single layer structure formed of ITO or IZO; or a laminatedmulti-layer structure formed of ITO and Cr, or of IZO and Cr.
 12. Themethod of claim 9, wherein the second electrode forming material is ametallic material including Al, Cu or Ag, or an alloy thereof.
 13. Themethod of claim 9, wherein each of the second bus electrode patterns hasa laminated multi-layer structure formed of ITO and the second electrodeforming material; or of IZO and the second electrode forming material.14. The method of claim 9, wherein each of the second bus electrodepatterns has a laminated multi-layer structure formed of ITO, Cr and thesecond electrode forming material; or of IZO, Cr and the secondelectrode forming material.
 15. A method for forming an organicelectroluminescence device comprising the steps of: forming firstelectrodes on a substrate in a single direction, the substrate having aluminous portion on which the first electrodes are formed and a padportion; forming first bus electrode patterns on the pad portion of thesubstrate such that the first bus electrode patterns are connected withthe first electrodes while forming the first electrodes, the first buselectrode patterns including a material for forming the firstelectrodes; forming second bus electrode patterns on the pad portion ofthe substrate while forming the first electrodes, the second buselectrode patterns including the first electrode forming material;forming an insulating layer pattern on the first electrodes and thesubstrate in a lattice shape to define plural pixel openings on thefirst electrodes; forming partition layers on the insulating layerpattern, the partition layers intersecting the first electrodesperpendicularly; forming barrier films between the first bus electrodepatterns and the second bus electrode patterns while forming thepartition layers; forming an organic thin film layer on the pixelopenings; forming second electrodes on the organic thin film layer to beperpendicular to the first electrodes; and depositing a second electrodeforming material on the first and the second bus electrode patternswhile forming the second electrodes.
 16. The method of claim 15, whereinthe barrier films formed between the second bus electrode patterns areconnected with the partition layers.
 17. The method of claim 15, whereinthe first bus electrode patterns have a single layer structure formed ofITO or IZO; or a laminated multi-layer structure formed of ITO and Cr,or of IZO and Cr.
 18. The method of claim 15, wherein the secondelectrode forming material is a metallic material including Al, Cu orAg, or an alloy thereof.
 19. The method of claim 15, wherein each of thesecond bus electrode patterns has a laminated multi-layer structureformed of ITO and the second electrode forming material; or of IZO andthe second electrode forming material.
 20. The method of claim 15,wherein each of the second bus electrode patterns has a laminatedmulti-layer structure formed of ITO, Cr and the second electrode formingmaterial; or of IZO, Cr and second electrode forming material.
 21. Amethod for forming an organic electroluminescence device comprising thesteps of: forming first electrodes on a substrate in a single direction,the substrate having a luminous portion on which the first electrodesare formed and a pad portion; forming first bus electrode patterns onthe pad portion of the substrate such that the first bus electrodepatterns are connected with the first electrodes while forming the firstelectrodes, the first bus electrode patterns including a material forforming the first electrodes; forming an insulating layer pattern on thefirst electrodes and the substrate in a lattice shape to define pluralpixel openings on the first electrodes; forming partition layers on theinsulating layer pattern, the partition layers intersecting the firstelectrodes perpendicularly; forming barrier films on the pad portion ofthe substrate while forming the partition layers; forming an organicthin film layer on the pixel openings; forming a mask film pattern forblocking the first bus electrode patterns; forming second electrodes onthe organic thin film layer to be perpendicular to the first electrodesby using the mask film pattern; and depositing a second electrodeforming material between the barrier films to thereby form second buselectrode patterns while forming the second electrodes.
 22. The methodof claim 21, wherein the second bus electrode patterns are connectedwith the second electrodes, while the barrier films between the secondbus electrode patterns are connected with the partition layers.
 23. Themethod of claim 21, wherein the second electrode forming material is ametallic material including Al, Cu, Ag, or an alloy thereof.
 24. Amethod for forming an organic electroluminescence device comprising thesteps of: forming first electrodes on a substrate in a single direction,the substrate having a luminous portion on which the first electrodesare formed and a pad portion; forming an insulating layer pattern on thefirst electrodes and the substrate in a lattice shape to define pluralpixel openings on the first electrodes; forming partition layers on theinsulating layer pattern, the partition layers intersecting the firstelectrodes perpendicularly; forming barrier films on the pad portion ofthe substrate while forming the partition layers; forming an organicthin film layer on the pixel openings; forming second electrodes on theorganic thin film layer to be perpendicular to the first electrodes; anddepositing a second electrode forming material between the barrier filmsto thereby form first and second bus electrode patterns while formingthe second electrodes.
 25. The method of claim 24, wherein the secondbus electrode patterns are connected with the second electrodes, whilethe barrier films between the second bus electrode patterns areconnected with the partition layers.
 26. The method of claim 24, whereinthe second electrode forming material is a metallic material includingAl, Cu, Ag, or an alloy thereof.